Based on the pmd (photonic mixer device) principle – which we have invented – our pixel detects intensity and distance values with a high level of accuracy in parallel.
By continually advancing the pixel design, we can reduce its size and increase its performance dramatically. Additionally, every pixel has our patented suppression of ambient light (SBI) directly integrated to deliver superior robustness against influences from other light sources, such as sunlight or other IR emitting light sources.
Left: VCSEL
Right: pmd Pixel
Together with our partner Infineon, we jointly develop and build the CMOS 3D image sensor based on our unique pmd pixel matrix. Infineon contributes all functional blocks for the system-on-chip (SoC) integration and together we developed the pmd ToF-optimized CMOS manufacturing process standard option.
As one of the biggest semiconductor manufacturers worldwide, Infineon already shipped millions of 3D image sensors and counting.
The facts represent the features of our latest 3D image sensor generation IRS2381C from 2020. Available for mass production.
Our in-house clean room and laboratories let us act quickly and independently.
The camera module combines our 3D image sensor with a lens, the VCSEL, and a processing unit in a housing so small that it fits into the notch of a smartphone. We evaluate and develop the reference designs of the modules based on the requirements of the final product. Our module manufacturing partners then use those reference designs as a blueprint to build the 3D camera modules for mass production.
Our VCSEL (vertical-cavity surface-emitting laser) emit the modulated light signal at high speeds of 100 MHz and beyond in a narrow spectrum of a few nanometers to light the scene. Although VCSELs are able to deliver a high level of optical power, our VCSEL-based illumination modules are designed to ensure that they are eye-safe and operate at low levels of power, which means they are ideal for mobile devices such as smartphones. Additional advantage of using a VCSEL are high levels of reliability and cost efficiency.
The camera module combines our 3D image sensor with a lens, the VCSEL, and a processing unit in a housing so small that it fits into the notch of a smartphone. We evaluate and develop the reference designs of the modules based on the requirements of the final product. Our module manufacturing partners then use those reference designs as a blueprint to build the 3D camera modules for mass product
Our VCSEL (vertical-cavity surface-emitting laser) emit the modulated light signal at high-speeds up to 100 MHz and beyond at a narrow spectrum of a few nanometer to light the scene. Although VCSEL are able to deliver high optical power, our VCSEL based illumination modules are designed to ensure eye-safe and also a low power operation, ideal suited for mobile devices such as smartphones. Additional advantage of using a VCSEL are the high reliability and cost efficiency.
The heart and soul of our software offering are our industry-leading time of flight processing algorithms. The firmware that runs on the 3D image sensor hands over the raw data from the sensor to our processing library. This software package then calculates the depth data used for applications like FaceID, AR and others, taking into account important aspects like accuracy, power consumption and CPU load.
Our Field Application Engineering team supports our partners, who build 3D camera modules in high volumes, with support, tools, and their extensive experience in building and producing ToF technology. From workshops to local on-site support and from calibration equipment to volume production quality checks, we help our production partners to build a high-quality 3D camera module with a high yield in high volumes.
