pmd 3D Development Kit for prototyping, research, and mass production. Available in cased form (Class 1 Laser Product) and uncased (not laser certified).
Powered by pmd ToF for industrial applications like autonomous navigation or the detection of volume, distance, or fill level.
3D Development platform with NXP i.MX 8M Mini processing unit and pmd ToF module & software.
Ready for single-unit development, prototyping, and full-scale mass production.
Choose the right resolution, framerate, field-of-view, and processing stack for your product.
Hardware and software are developed for maximum compatibility and seamless integration into your product. Build your own or Plug&Play.
Proven reliability with over 20 years of experience and production know-how in depth-sensing hardware and software.
Our product family and SDKs supports many different software frameworks and languages. Start developing with ROS 1/2, Python, OpenCV, OpenNI2, Matlab, C, DotNet, Windows, and Linux/ARM. Just to name a few.
A strong and global partner network of experts from the Time-of-Flight development on pixel level to mass production of industrial-grade 3D cameras.
Fill out the form to be one of the first to receive our latest 3D depth sensing Development Kits. Our 3D experts will then contact you to find the right solution for your project. We ask you to briefly describe your project to provide you with the right information and give us some time to answer all requests.
Reserve* your spot on the waitlist to be the first to receive the new flexx2, with shipments beginning in February. As a customer of the "old" pico flexx or pico monstar, you will get priority access to order the new flexx2.
*Starting price of one unit will be US$399/355€. With quantities of 20 units and more, the price will decrease. Production pricing for higher volumes is available. No binding order. Can be subject to change.
|pmd flexx2 DevKit / OEM||Emcraft System on Module||ifm 3D Cameras|
Encased, CE Certified,
Class 1 Laser Product
No casing, no CE Certification,
not laser certified
(must be done by end-user)
i.MX 8M Mini Quad|
16 GB eMMC
ToF Module: Sunny or LiteOn
Video Processing Unit (VPU)
connects up to six 3D+2D cameras
|Size||72.1 x 19.2 x 10.2 mm||18.93 x 18.6 x 5.33 mm||
90 x 31 x 26 mm (camera)|
180 x 30 x 125 mm (VPU)
|Resolution||224 x 172||224 x 172||
224 x 172 (3D) |
1280 x 800 (2D)
|ToF Sensor||IRS2381C Infineon® REAL3™ 3D Image Sensor||LiteOn: IRS1645C Infineon® REAL3™ 3D Sensor |
Sunny: IRS2381C Infineon® REAL3™ 3D Sensor
|Illumination||940nm 1 Watt VCSEL (LC1)||940nm 1 Watt VCSEL (LC1)||940nm 1 Watt VCSEL (LC1)|
|Framerate||Up to 60fps (3D frames)||Up to 60fps (3D frames)||20fps (2D and 3D frames)|
56 x 44 FOV ||LiteOn: 105 x 85 FOV|
Sunny: 60 x 40 FOV
| 105 x 78 3D FOV|
128 x 80 2D FOV
|Range||0.1m - 4m||0.1m - 4m||0.1 - 4m|
|Interface||USB3 Type-C||Camera interfaces i.MX 8M Mini via 2-lane MIPI-CSI2 and I2C||VPU: CAN, 2x 1GB Ethernet; GIGE, USB3.0; USBmini|
<= 1% of distance (0.5 –4m @ 5fps)|
<= 2% of distance (0.1 –1m @ 45fps)
<= 1% of distance (0.5 –3m @ 5fps)|
<= 2% of distance (0.1 –1m @60 fps)
Royale SDK C/C++ based|
OpenEmbedded Linux OS running Royale SDK,|
ROS 1 support available