Infineon and pmd @ MWC 2021

A look through the surface - and beyond!

Enabling a new design generation of smartphones
by eliminating the notch.

Since the last MWC we brought new innovations to Time-of-Flight technology for mobile applications. Allowing smartphone manufacturers to bring exciting new applications into the hands of millions of customers.
Our VGA ToF sensor with a resolution of 640x480 3D pixels made face authentication more secure and reliable than ever before. Especially important in today’s context, where mobile payment became a matter of personal safety.

This year we take ToF to the next level or to be more specific: under the surface. Join us for an exclusive digital meeting session during MWC 2021 and take a look beyond to learn how we make our 3D camera modules see through the display. For new smartphone designs without a notch.

With the latest ToF sensor generation specially developed for long-range applications we revolutionized the camera system of flagship phones by providing high-speed autofocus and beautiful bokeh effects even in low light situations, based on accurate depth information in every part of the scene.

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Join us for an exclusive digital meeting session during MWC 2021 to be the first to learn more about our latest developments and experience a virtual live demo.

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MWC 2021
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