Reliable and secure face authentication, enhanced photo functionalities and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data on both sides of the phone.
Our miniaturized new 3D VGA module is a perfect fit for smartphones. By combining the new VGA imager IRS2877C (640x480 3D pixels) and the specially developed IRS9100C illumination driver from our partner Infineon we have reduced the design complexity, module size, calibration effort and bill of materials (BOM). Simultaneously we increased the efficiency to offer a powerful 3D depth-sensing module for front-facing applications.
Jointly developed reference designs for face-authentication use-cases are also available for the Qualcomm® Snapdragon™ 865 Mobile Platform.
In addition to that, the LG G8ThinQ can recognize a user’s unique pattern of palm veins, adding speed and convenience to unlocking the phone. This so-called multirecognition reduces the ability of a hacker to build a spoofing artifact to mimic the user’s physical attribute. On top of this, the live bokeh function of the G8ThinQ enables aesthetic adjustments in real time even while taking videos – and not only in post-photography. The user can also interact with the smartphone in the third dimension “beyond touch” by giving commands using hand gestures thanks to the Air Motion feature.
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Building on the success of the now-discontinued “PicoFlexx”, which already brought 3D depth-sensing technology to the hands of thousands of developers worldwide, we are happy to share the newest member of our pmd 3D Sensing Family with you.
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Say hello to the most flexible and advanced 3D Time-of-Flight product family on the market to add depth sensing and processing to your product.
Sharp announces 5G Smartphone with world facing Infineon REAL3™ 3D Image Sensor for 8K video bokeh and photo effects
For the first time, a smartphone with a dedicated user-facing time-of-flight (ToF) camera is entering the mass market.