Reliable and secure face authentication, enhanced photo functionalities and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data on both sides of the phone.
Our miniaturized new 3D VGA module is a perfect fit for smartphones. By combining the new VGA imager IRS2877C (640x480 3D pixels) and the specially developed IRS9100C illumination driver from our partner Infineon we have reduced the design complexity, module size, calibration effort and bill of materials (BOM). Simultaneously we increased the efficiency to offer a powerful 3D depth-sensing module for front-facing applications.
Jointly developed reference designs for face-authentication use-cases are also available for the Qualcomm® Snapdragon™ 865 Mobile Platform.
In addition to that, the LG G8ThinQ can recognize a user’s unique pattern of palm veins, adding speed and convenience to unlocking the phone. This so-called multirecognition reduces the ability of a hacker to build a spoofing artifact to mimic the user’s physical attribute. On top of this, the live bokeh function of the G8ThinQ enables aesthetic adjustments in real time even while taking videos – and not only in post-photography. The user can also interact with the smartphone in the third dimension “beyond touch” by giving commands using hand gestures thanks to the Air Motion feature.
Experience new realities with AR-Headsets and precise environmental scanning.
Enable autonomous navigation of cleaning robots or smart home security applications
Make drones fly autonomously in complex environments with 3D depth sensing
True-to-size 3D body model reconstruction for exact fitting.
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Roborock has teamed up with Infineon, pmdtechnologies and Ofilm to develop a next generation robot solution that uses hybrid Time-of-Flight (hToF) to replace the traditional laser distance scanner (LDS) module and obstacle avoidance module.
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Older robot vacuum cleaners used a random, inefficient, and slow cleaning pattern. Smart robots generate a map of their environment using sensors and simultaneous localization and mapping (SLAM) to localize, providing users with a floorplan from which areas can be selected for cleaning, or restricted from access. This whitepaper describes designing slimmer robots with new features using an approach with novel time-of-flight cameras.
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In collaboration with device manufacturer OMS and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), we have developed a new high-resolution camera solution that enables enhanced depth sensing and 3D scene understanding for next-generation smart consumer robots. The new hybrid Time of Flight solution combines two depth sensing concepts and helps significantly reduce maintenance effort and costs for smart robots.
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Our new i-ToF imager enables smallest 3D camera systems with improved quantum efficiency at optimized cost
