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Webcast: 3D image sensor market – growth potential for extended applications

Watch the official press event and learn more about our solution for long range Time-of-Flight applications.

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Today’s smartphones have to offer a lot to appeal to users, especially to meet rising demand for high-quality photography effects and — more recently — a wide range of augmented/mixed-reality (AR/MR) functions. All of these are possible with Infineon’s new 3D imager based on time-of-flight pixel technology from pmdtechnologies.

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Full of excitement we are now looking towards 2021 with an all-digital CES beginning January 11th and many more news, advancements and upcoming products based on pmd’s unique Time-of-Flight technology.

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Join us for an exclusive digital meeting session during CES 2021 to be the first to learn more about our latest imager and get a virtual live demo.

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The new chip allows the integration into miniaturized camera modules, accurately measuring depth in short and long range for AR while meeting low power consumption requirements with more than 40 percent power saving on the imager.