5 years ago, President Obama and Chancellor Merkel visited the booth of our mother company ifm electronic at Hannover Messe 2016 where our CEO Bernd Buxbaum gave a lasting presentation of our 3D ToF technology. Pictures that went around the world and still giving us goosebumps today.
We made a short video to take you back to that day and review – 5 years later - where we are today with our technology.
You can also check out, what ifm is presenting at this years Hannover Messe, regarding 3D vision for industrial applications:
The Live Event starts at 5pm MESZ (ticket required).
Michael Eisenstein, Science Writer at Photonics Media published an article about 3D imaging technologies.
pmdtechnologies’ and Infineon’s latest 3D Time-of-Flight image sensor enables powerful new applications for mobile such as real-time mixed reality, enhanced photography, 3D object scanning, and room reconstruction. Integrated into the world’s smallest 3D ToF camera modules, the complete solution accurately...
We are at (digital) Image Senors Europe 2021 and our CEO Dr. Bernd Buxbaum will join as a speaker on Conference Day one, 23rd March, giving you insights about the latest developments in 3D depthsensing for smartphones.
Today’s smartphones have to offer a lot to appeal to users, especially to meet rising demand for high-quality photography effects and — more recently — a wide range of augmented/mixed-reality (AR/MR) functions. All of these are possible with Infineon’s new 3D imager based on time-of-flight pixel technology from pmdtechnologies.