Read the latest press releases about new technological developments, product announcements and pmd-partnerships to be up to date in the world of Time-of-Flight depth-sensing technology.
Watch the official press event and learn more about our solution for long range Time-of-Flight applications.
The new chip allows the integration into miniaturized camera modules, accurately measuring depth in short and long range for AR while meeting low power consumption requirements with more than 40 percent power saving on the imager.
Get a look behind the scenes of the elaborate shooting of "The Time-of-Flight". Each set is a specially created art installation, which in an abstract way explains the principle of our 3D depth sensing technology. Everything starts with a pixel!
Sharp announces 5G Smartphone with world facing Infineon REAL3™ 3D Image Sensor for 8K video bokeh and photo effects
The new VGA 3D imager is the highest resolution, most flexible and robust depth sensor that has ever been developed by pmd and Infineon.
Infineon has collaborated with software and 3D Time of Flight specialist pmdtechnologies to develop the world’s smallest and at the same time most powerful 3D image sensor.
Smartphone cameras increasingly require 3D vision capabilities as differentiating factor.
The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular, demand for higher resolutions with small lenses.