Read the latest press releases about new technological developments, product announcements and pmd-partnerships to be up to date in the world of Time-of-Flight depth-sensing technology.
#tradeshows, #business, #technology
5 years ago, President Obama and Chancellor Merkel visited the booth of our mother company ifm electronic at Hannover Messe 2016 where our CEO Bernd Buxbaum gave a lasting presentation of our 3D ToF technology.
pmdtechnologies’ and Infineon’s latest 3D Time-of-Flight image sensor enables powerful new applications for mobile such as real-time mixed reality, enhanced photography, 3D object scanning, and room reconstruction. Integrated into the world’s smallest 3D ToF camera modules, the complete solution accurately...
Today’s smartphones have to offer a lot to appeal to users, especially to meet rising demand for high-quality photography effects and — more recently — a wide range of augmented/mixed-reality (AR/MR) functions. All of these are possible with Infineon’s new 3D imager based on time-of-flight pixel technology from pmdtechnologies.
Watch the official press event and learn more about our solution for long range Time-of-Flight applications.
The new chip allows the integration into miniaturized camera modules, accurately measuring depth in short and long range for AR while meeting low power consumption requirements with more than 40 percent power saving on the imager.
Get a look behind the scenes of the elaborate shooting of "The Time-of-Flight". Each set is a specially created art installation, which in an abstract way explains the principle of our 3D depth sensing technology. Everything starts with a pixel!
Sharp announces 5G Smartphone with world facing Infineon REAL3™ 3D Image Sensor for 8K video bokeh and photo effects
The new VGA 3D imager is the highest resolution, most flexible and robust depth sensor that has ever been developed by pmd and Infineon.