Read the latest press releases about new technological developments, product announcements and pmd-partnerships to be up to date in the world of Time-of-Flight depth-sensing technology.
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Building on the success of the now-discontinued “PicoFlexx”, which already brought 3D depth-sensing technology to the hands of thousands of developers worldwide, we are happy to share the newest member of our pmd 3D Sensing Family with you.
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Say hello to the most flexible and advanced 3D Time-of-Flight product family on the market to add depth sensing and processing to your product.
Announcing a turnkey solution that allows a ToF camera to work under the display of commercial smartphones while still providing reliable high quality 3D data for security relevant applications.
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5 years ago, President Obama and Chancellor Merkel visited the booth of our mother company ifm electronic at Hannover Messe 2016 where our CEO Bernd Buxbaum gave a lasting presentation of our 3D ToF technology.
pmdtechnologies’ and Infineon’s latest 3D Time-of-Flight image sensor enables powerful new applications for mobile such as real-time mixed reality, enhanced photography, 3D object scanning, and room reconstruction. Integrated into the world’s smallest 3D ToF camera modules, the complete solution accurately...
Today’s smartphones have to offer a lot to appeal to users, especially to meet rising demand for high-quality photography effects and — more recently — a wide range of augmented/mixed-reality (AR/MR) functions. All of these are possible with Infineon’s new 3D imager based on time-of-flight pixel technology from pmdtechnologies.
Watch the official press event and learn more about our solution for long range Time-of-Flight applications.
The new chip allows the integration into miniaturized camera modules, accurately measuring depth in short and long range for AR while meeting low power consumption requirements with more than 40 percent power saving on the imager.