pmd and Infineon host digital MWC 2021

Since the last MWC we brought new innovations to Time-of-Flight technology for mobile applications. Allowing smartphone manufacturers to bring exciting new applications into the hands of millions of customers.
Our VGA ToF sensor with a resolution of 640x480 3D pixels made face authentication more secure and reliable than ever before. Especially important in today’s context, where mobile payment became a matter of personal safety.

With the latest ToF sensor generation specially developed for long-range applications we revolutionized the camera system of flagship phones by providing high-speed autofocus and beautiful bokeh effects even in low light situations, based on accurate depth information in every part of the scene.

This year we take ToF to the next level or to be more specific: under the surface. Join us for an exclusive digital meeting session during MWC 2021 from 28 June - 1 July and take a look beyond to learn how we make our 3D camera modules see through the display. For new smartphone designs without a notch.

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In collaboration with device manufacturer OMS and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), we have developed a new high-resolution camera solution that enables enhanced depth sensing and 3D scene understanding for next-generation smart consumer robots. The new hybrid Time of Flight solution combines two depth sensing concepts and helps significantly reduce maintenance effort and costs for smart robots.

Group Photo

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At Hanover Messe 2023, German Chancellor Olaf Scholz and Indonesian President Joko Widodo visited the booth of ifm and pmd.

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Our new i-ToF imager enables smallest 3D camera systems with improved quantum efficiency at optimized cost

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Latest i-ToF imager based on Infineon’s and pmd's novel pixel technology boosts 3D camera system performance at optimized cost