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pmd and Infineon host digital MWC 2021

Since the last MWC we brought new innovations to Time-of-Flight technology for mobile applications. Allowing smartphone manufacturers to bring exciting new applications into the hands of millions of customers.
Our VGA ToF sensor with a resolution of 640x480 3D pixels made face authentication more secure and reliable than ever before. Especially important in today’s context, where mobile payment became a matter of personal safety.

With the latest ToF sensor generation specially developed for long-range applications we revolutionized the camera system of flagship phones by providing high-speed autofocus and beautiful bokeh effects even in low light situations, based on accurate depth information in every part of the scene.

This year we take ToF to the next level or to be more specific: under the surface. Join us for an exclusive digital meeting session during MWC 2021 from 28 June - 1 July and take a look beyond to learn how we make our 3D camera modules see through the display. For new smartphone designs without a notch.

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Building on the success of the now-discontinued “PicoFlexx”, which already brought 3D depth-sensing technology to the hands of thousands of developers worldwide, we are happy to share the newest member of our pmd 3D Sensing Family with you.

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Say hello to the most flexible and advanced 3D Time-of-Flight product family on the market to add depth sensing and processing to your product.

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Announcing a turnkey solution that allows a ToF camera to work under the display of commercial smartphones while still providing reliable high quality 3D data for security relevant applications.

Michael Eisenstein, Science Writer at Photonics Media published an article about 3D imaging technologies.