Read the latest press releases about new technological developments, product announcements and pmd-partnerships to be up to date in the world of Time-of-Flight depth-sensing technology.
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Get a look behind the scenes of the elaborate shooting of "The Time-of-Flight". Each set is a specially created art installation, which in an abstract way explains the principle of our 3D depth sensing technology. Everything starts with a pixel!
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Infineon collaborates with Qualcomm to enable high-quality standard solution for 3D authentication
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Sharp announces 5G Smartphone with world facing Infineon REAL3™ 3D Image Sensor for 8K video bokeh and photo effects
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The new VGA 3D imager is the highest resolution, most flexible and robust depth sensor that has ever been developed by pmd and Infineon.
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Infineon has collaborated with software and 3D Time of Flight specialist pmdtechnologies to develop the world’s smallest and at the same time most powerful 3D image sensor.
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Smartphone cameras increasingly require 3D vision capabilities as differentiating factor.
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The partnership has created “Holkin”, a new reference design specifically developed for mobile applications.
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The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular, demand for higher resolutions with small lenses.