Read the latest press releases about new technological developments, product announcements and pmd-partnerships to be up to date in the world of Time-of-Flight depth-sensing technology.
Get a look behind the scenes of the elaborate shooting of "The Time-of-Flight". Each set is a specially created art installation, which in an abstract way explains the principle of our 3D depth sensing technology. Everything starts with a pixel!
Infineon collaborates with Qualcomm to enable high-quality standard solution for 3D authentication
Sharp announces 5G Smartphone with world facing Infineon REAL3™ 3D Image Sensor for 8K video bokeh and photo effects
The new VGA 3D imager is the highest resolution, most flexible and robust depth sensor that has ever been developed by pmd and Infineon.
Infineon has collaborated with software and 3D Time of Flight specialist pmdtechnologies to develop the world’s smallest and at the same time most powerful 3D image sensor.
Smartphone cameras increasingly require 3D vision capabilities as differentiating factor.
The partnership has created “Holkin”, a new reference design specifically developed for mobile applications.
The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular, demand for higher resolutions with small lenses.