Read the latest press releases about new technological developments, product announcements and pmd-partnerships to be up to date in the world of Time-of-Flight depth-sensing technology.
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5 years ago, President Obama and Chancellor Merkel visited the booth of our mother company ifm electronic at Hannover Messe 2016 where our CEO Bernd Buxbaum gave a lasting presentation of our 3D ToF technology.
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pmdtechnologies’ and Infineon’s latest 3D Time-of-Flight image sensor enables powerful new applications for mobile such as real-time mixed reality, enhanced photography, 3D object scanning, and room reconstruction. Integrated into the world’s smallest 3D ToF camera modules, the complete solution accurately...
We are at (digital) Image Senors Europe 2021 and our CEO Dr. Bernd Buxbaum will join as a speaker on Conference Day one, 23rd March, giving you insights about the latest developments in 3D depthsensing for smartphones.
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Today’s smartphones have to offer a lot to appeal to users, especially to meet rising demand for high-quality photography effects and — more recently — a wide range of augmented/mixed-reality (AR/MR) functions. All of these are possible with Infineon’s new 3D imager based on time-of-flight pixel technology from pmdtechnologies.
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Full of excitement we are now looking towards 2021 with an all-digital CES beginning January 11th and many more news, advancements and upcoming products based on pmd’s unique Time-of-Flight technology.
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Join us for an exclusive digital meeting session during CES 2021 to be the first to learn more about our latest imager and get a virtual live demo.
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Watch the official press event and learn more about our solution for long range Time-of-Flight applications.
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The new chip allows the integration into miniaturized camera modules, accurately measuring depth in short and long range for AR while meeting low power consumption requirements with more than 40 percent power saving on the imager.