Read the latest press releases about new technological developments, product announcements and pmd-partnerships to be up to date in the world of Time-of-Flight depth-sensing technology.
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Today’s smartphones have to offer a lot to appeal to users, especially to meet rising demand for high-quality photography effects and — more recently — a wide range of augmented/mixed-reality (AR/MR) functions. All of these are possible with Infineon’s new 3D imager based on time-of-flight pixel technology from pmdtechnologies.
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Full of excitement we are now looking towards 2021 with an all-digital CES beginning January 11th and many more news, advancements and upcoming products based on pmd’s unique Time-of-Flight technology.
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Join us for an exclusive digital meeting session during CES 2021 to be the first to learn more about our latest imager and get a virtual live demo.
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Watch the official press event and learn more about our solution for long range Time-of-Flight applications.
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The new chip allows the integration into miniaturized camera modules, accurately measuring depth in short and long range for AR while meeting low power consumption requirements with more than 40 percent power saving on the imager.
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Together with our partner Infineon Technologies we believe in 3D depth data. That AR will pervade our lives. The long-range REAL3™ Time-of-Flight imager delivers on this vision.
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Get a look behind the scenes of the elaborate shooting of "The Time-of-Flight". Each set is a specially created art installation, which in an abstract way explains the principle of our 3D depth sensing technology. Everything starts with a pixel!
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Infineon collaborates with Qualcomm to enable high-quality standard solution for 3D authentication