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Mobile World Congress 2018

Introducing the latest 3D Time-of-Flight imager for mobile devices from Infineon and pmdtechnologies. The world’s smallest 3D Time-of-Flight module, developed by pmd, has become even smaller – and better! Featuring the new, smaller imager, integrated eye-safety features, a reduced PCB area and component count, SPI flash support and an optimized illumination concept with bare die VCSEL.

  • World’s smallest form factor
  • Sunlight robust
  • Minimal power consumption
  • Proven in mass production
  • Easy design-in
  • Fast once-a-lifetime calibration
  • BoM cost-optimized


It fits perfectly into today’s smartphones top bezel and unlocks a completely new level of applications for user experience. From secure 3D face unlock, face tracking and avatar animation to selfie background removal. On the world-facing side, the depth camera sets new standards for high sophisticated augmented reality, accurate 3D scanning and environmental monitoring.

Welcome to state-of-the-art 3D depth sensing, jointly developed by Infineon and pmdtechnologies!

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pmdtechnologies’ and Infineon’s latest 3D Time-of-Flight image sensor enables powerful new applications for mobile such as real-time mixed reality, enhanced photography, 3D object scanning, and room reconstruction. Integrated into the world’s smallest 3D ToF camera modules, the complete solution accurately...

We are at (digital) Image Senors Europe 2021 and our CEO Dr. Bernd Buxbaum will join as a speaker on Conference Day one, 23rd March, giving you insights about the latest developments in 3D depthsensing for smartphones.

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Today’s smartphones have to offer a lot to appeal to users, especially to meet rising demand for high-quality photography effects and — more recently — a wide range of augmented/mixed-reality (AR/MR) functions. All of these are possible with Infineon’s new 3D imager based on time-of-flight pixel technology from pmdtechnologies.