News
Mobile World Congress 2018

Introducing the latest 3D Time-of-Flight imager for mobile devices from Infineon and pmdtechnologies. The world’s smallest 3D Time-of-Flight module, developed by pmd, has become even smaller – and better! Featuring the new, smaller imager, integrated eye-safety features, a reduced PCB area and component count, SPI flash support and an optimized illumination concept with bare die VCSEL.

  • World’s smallest form factor
  • Sunlight robust
  • Minimal power consumption
  • Proven in mass production
  • Easy design-in
  • Fast once-a-lifetime calibration
  • BoM cost-optimized


It fits perfectly into today’s smartphones top bezel and unlocks a completely new level of applications for user experience. From secure 3D face unlock, face tracking and avatar animation to selfie background removal. On the world-facing side, the depth camera sets new standards for high sophisticated augmented reality, accurate 3D scanning and environmental monitoring.

Welcome to state-of-the-art 3D depth sensing, jointly developed by Infineon and pmdtechnologies!

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Our 3D Time-of-Flight depth-sensing technology is a key component to bring truly immersive and real-to-life experiences to the new augmented reality headset Magic Leap 2.

Countless exciting and industry-changing projects are built upon the flexibility and reliability of our 3D Development Kits and make use of our high-quality depth data. What will you build?