News
Mobile World Congress 2018

Introducing the latest 3D Time-of-Flight imager for mobile devices from Infineon and pmdtechnologies. The world’s smallest 3D Time-of-Flight module, developed by pmd, has become even smaller – and better! Featuring the new, smaller imager, integrated eye-safety features, a reduced PCB area and component count, SPI flash support and an optimized illumination concept with bare die VCSEL.

  • World’s smallest form factor
  • Sunlight robust
  • Minimal power consumption
  • Proven in mass production
  • Easy design-in
  • Fast once-a-lifetime calibration
  • BoM cost-optimized


It fits perfectly into today’s smartphones top bezel and unlocks a completely new level of applications for user experience. From secure 3D face unlock, face tracking and avatar animation to selfie background removal. On the world-facing side, the depth camera sets new standards for high sophisticated augmented reality, accurate 3D scanning and environmental monitoring.

Welcome to state-of-the-art 3D depth sensing, jointly developed by Infineon and pmdtechnologies!

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EETimes Cover Page

#technology

Today’s smartphones have to offer a lot to appeal to users, especially to meet rising demand for high-quality photography effects and — more recently — a wide range of augmented/mixed-reality (AR/MR) functions. All of these are possible with Infineon’s new 3D imager based on time-of-flight pixel technology from pmdtechnologies.

#business

Full of excitement we are now looking towards 2021 with an all-digital CES beginning January 11th and many more news, advancements and upcoming products based on pmd’s unique Time-of-Flight technology.

#tradeshows

Join us for an exclusive digital meeting session during CES 2021 to be the first to learn more about our latest imager and get a virtual live demo.

#business, #technology

Watch the official press event and learn more about our solution for long range Time-of-Flight applications.