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CES 2021 - #AR-range your meeting!

Experience the next revolution in 3D Time-of-Flight depth-sensing. With our latest imager for long-range scanning of up to 10 meters, we are setting the foundation for a new area of applications and use-cases in mobile. The cutting-edge measuring range and resolution of our 3D technology enables new immersive AR experiences and more advanced low-light photography with beautiful bokeh effects and faster autofocus.

Join us for an exclusive digital meeting session during CES 2021 to be the first to learn more about our latest imager and get a virtual live demo.

Take a look beyond and schedule your meeting at our dedicated CES Landingpage.

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EETimes Cover Page

#technology

Today’s smartphones have to offer a lot to appeal to users, especially to meet rising demand for high-quality photography effects and — more recently — a wide range of augmented/mixed-reality (AR/MR) functions. All of these are possible with Infineon’s new 3D imager based on time-of-flight pixel technology from pmdtechnologies.

#business

Full of excitement we are now looking towards 2021 with an all-digital CES beginning January 11th and many more news, advancements and upcoming products based on pmd’s unique Time-of-Flight technology.

#business, #technology

Watch the official press event and learn more about our solution for long range Time-of-Flight applications.

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The new chip allows the integration into miniaturized camera modules, accurately measuring depth in short and long range for AR while meeting low power consumption requirements with more than 40 percent power saving on the imager.