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CES 2021 - #AR-range your meeting!

Experience the next revolution in 3D Time-of-Flight depth-sensing. With our latest imager for long-range scanning of up to 10 meters, we are setting the foundation for a new area of applications and use-cases in mobile. The cutting-edge measuring range and resolution of our 3D technology enables new immersive AR experiences and more advanced low-light photography with beautiful bokeh effects and faster autofocus.

Join us for an exclusive digital meeting session during CES 2021 to be the first to learn more about our latest imager and get a virtual live demo.

Take a look beyond and schedule your meeting at our dedicated CES Landingpage.

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#tradeshows, #business, #technology

5 years ago, President Obama and Chancellor Merkel visited the booth of our mother company ifm electronic at Hannover Messe 2016 where our CEO Bernd Buxbaum gave a lasting presentation of our 3D ToF technology.

Banner Online Session pmd and Infineon

#business, #technology

pmdtechnologies’ and Infineon’s latest 3D Time-of-Flight image sensor enables powerful new applications for mobile such as real-time mixed reality, enhanced photography, 3D object scanning, and room reconstruction. Integrated into the world’s smallest 3D ToF camera modules, the complete solution accurately...

We are at (digital) Image Senors Europe 2021 and our CEO Dr. Bernd Buxbaum will join as a speaker on Conference Day one, 23rd March, giving you insights about the latest developments in 3D depthsensing for smartphones.

EETimes Cover Page

#technology

Today’s smartphones have to offer a lot to appeal to users, especially to meet rising demand for high-quality photography effects and — more recently — a wide range of augmented/mixed-reality (AR/MR) functions. All of these are possible with Infineon’s new 3D imager based on time-of-flight pixel technology from pmdtechnologies.