Read the latest press releases about new technological developments, product announcements and pmd-partnerships to be up to date in the world of Time-of-Flight depth-sensing technology.
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Say hello to the most flexible and advanced 3D Time-of-Flight product family on the market to add depth sensing and processing to your product.
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This year we take ToF to the next level or to be more specific: under the surface. Join us for an exclusive digital meeting session during MWC 2021 from 28 June - 1 July.
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5 years ago, President Obama and Chancellor Merkel visited the booth of our mother company ifm electronic at Hannover Messe 2016 where our CEO Bernd Buxbaum gave a lasting presentation of our 3D ToF technology.
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pmdtechnologies’ and Infineon’s latest 3D Time-of-Flight image sensor enables powerful new applications for mobile such as real-time mixed reality, enhanced photography, 3D object scanning, and room reconstruction. Integrated into the world’s smallest 3D ToF camera modules, the complete solution accurately...
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Full of excitement we are now looking towards 2021 with an all-digital CES beginning January 11th and many more news, advancements and upcoming products based on pmd’s unique Time-of-Flight technology.
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Watch the official press event and learn more about our solution for long range Time-of-Flight applications.
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Get a look behind the scenes of the elaborate shooting of "The Time-of-Flight". Each set is a specially created art installation, which in an abstract way explains the principle of our 3D depth sensing technology. Everything starts with a pixel!
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Infineon collaborates with Qualcomm to enable high-quality standard solution for 3D authentication