Today we are proudly announcing the third mass market smartphone with our 3D depth-sensing technology inside. Jointly developed by LG, Infineon and pmd we are bringing enhanced security and depth measuring to the selfie camera of the new LG G8 ThinQ, which will be officially introduced at Mobile World Congress on February 24th. Stay tuned for more info about the exiting capabilities our 3D ToF technology brings to this revolutionary phone!
LG Electronics and Infineon Technologies AG have teamed up to introduce leading edge Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over.
Infineon’s REAL3™ image sensor chip will play a key role in the front-facing camera of the upcoming LG G8 ThinQ, to be unveiled in Barcelona during Mobile World Congress 2019. Building upon the combined expertise of Infineon and pmdtechnologies in algorithms for processed 3D point clouds (a set of data points in space produced by 3D scanning), the innovative sensor will deliver a new level of front camera capability in a smartphone.
“Infineon is poised to revolutionize the market,” said Andreas Urschitz, division president of Infineon’s Power Management & Multimarket division. “We have demonstrated service beyond the mere product level – specifically catering to phone OEMs, associated reference design houses and camera module manufacturers. Within five years, we expect 3D cameras to be found in most smartphones and Infineon will contribute a significant share.”
“Keeping in mind LG’s goal to provide real value to its mobile customers, our newest flagship was designed with ToF technology from inception to give users a unique and secure verification system without sacrificing camera capabilities,” said Chang Ma, senior vice president and head of Product Strategy at LG Mobile Communications Company. “The LG G8 ThinQ featuring ToF will be the optimal choice for users in search of a premium smartphone that offers unmatched camera capabilities.”
Please find the complete PRs here: