Read the latest press releases about new technological developments, product announcements and pmd-partnerships to be up to date in the world of Time-of-Flight depth-sensing technology.
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Say hello to the most flexible and advanced 3D Time-of-Flight product family on the market to add depth sensing and processing to your product.
Announcing a turnkey solution that allows a ToF camera to work under the display of commercial smartphones while still providing reliable high quality 3D data for security relevant applications.
This year we take ToF to the next level or to be more specific: under the surface. Join us for an exclusive digital meeting session during MWC 2021 from 28 June - 1 July.
Michael Eisenstein, Science Writer at Photonics Media published an article about 3D imaging technologies.
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5 years ago, President Obama and Chancellor Merkel visited the booth of our mother company ifm electronic at Hannover Messe 2016 where our CEO Bernd Buxbaum gave a lasting presentation of our 3D ToF technology.
pmdtechnologies’ and Infineon’s latest 3D Time-of-Flight image sensor enables powerful new applications for mobile such as real-time mixed reality, enhanced photography, 3D object scanning, and room reconstruction. Integrated into the world’s smallest 3D ToF camera modules, the complete solution accurately...
We are at (digital) Image Senors Europe 2021 and our CEO Dr. Bernd Buxbaum will join as a speaker on Conference Day one, 23rd March, giving you insights about the latest developments in 3D depthsensing for smartphones.
Today’s smartphones have to offer a lot to appeal to users, especially to meet rising demand for high-quality photography effects and — more recently — a wide range of augmented/mixed-reality (AR/MR) functions. All of these are possible with Infineon’s new 3D imager based on time-of-flight pixel technology from pmdtechnologies.