Location: Siegen
Reference Number: 2020-1120
In an interdisciplinary project team with other engineers and physicists, you will support the development of innovative 3D camera modules for integration into smartphones or similar consumer products. As an all-rounder, you will accompany all development steps at our site in Siegen and with customers in Germany and abroad: Together with the customer's project team, you will design the circuits, layout the PCBs, accompany the prototype production and then commission the module. In particular, you will deal with HF-modulated illuminations such as LED, EEL and VCSEL and efficient low-cost power supplies. You will be responsible for the Spice simulation as well as the testing and analysis of new circuits and components. You will also support our customers in the area of product safety, especially laser safety. Thanks to your good communication skills, you will always keep in touch with your team colleagues and production, thus ensuring successful development.