Mobile World Congress 2019
    Get ready for the next chapter of 3D depth-sensing in smartphones.

    At MWC 2019 pmd and Infineon will bring 3D depth-sensing to the next level. Join us for the introduction of our new 3D imager with 7μm pixels and experience its performance and superior ambient light robustness!

    We invite you to visit us at MWC 2019 to learn more about our latest developments and our breakthroughs in 3D depth sensing, including the lowest production test-time of any 3D technology on the market and a new filtering technology that improves 3D output without increasing processor overhead.
    All this adds up to the achievements and maturity of our 3D technology and its proven optimization for high volume production in several smartphones and many other products like cars, AR headsets and smart home devices.

    In addition to that, the latest product with our Time-of-Flight technology inside will be unveiled. Be part of it!

    Please find our invitation here and get in touch with us to fix a meeting using

    MWC 2019 Location:
    Mobile World Congress 2019

    Barcelona, Spain
    Fira Gran Via
    Infineon Booth
    Hall 6, Room 6O76MR